Industry News

Henkel Loctite Introduces Epoxy Molding Coumpound

Published on 2003-10-08. Author : SpecialChem


Henkel Loctite Corp. has introduced Hysol GR725, a semiconductor-grade molding compound designed for use on Power ICs and Power Discrete devices that operate at high temperatures and require good electrical stability.It is a green, non-Bromine/Antimony, epoxy cresol novolac-type material with excellent molding characteristics.

The product is flame retardant and offers good adhesion to Ni/Pd/Au and Cu/Ag lead frames. This high-productivity molding compound offers a wide processing window and provides 20,000 hours at 200 degrees C HTSL. It meets JEDEC Level 1 260 degrees C reflow requirements and UL 94 V-O at 1/8-inch thickness.

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