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Lord to Present an Overview of Low-stress Electronic Packaging and Encapsulation Materials

Published on 2011-08-10. Author : SpecialChem

Cary, NC -- LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - has announced that Larry Wang, Ph.D., staff scientist, Electronic Materials Research and Development at LORD Corporation, will present a paper at the 2011 Electrical Manufacturing and Coil Winding Expo.

The paper will be presented on Sept. 21 at the Opryland Convention Center in Nashville, Tenn. Wang's paper is entitled: "Inherently Flexible Epoxy Encapsulant - New Alternative for Low-Stress Electronic Packaging."

The presentation will provide an overview of low-stress electronic packaging and new encapsulation materials and solutions, such as flexible epoxy gels, to meet the need of protecting sensitive components in harsh environments. Results of physical and mechanical property testing, chemical and humidity exposure, and high-temperature exposure experiments will be discussed. In today's marketplace, electronic component technology has been moving steadily towards high functionality, smaller size and complex designs. At the same time, components are being used in a wide variety of industries and integrated into new and more demanding applications than ever before. To meet these industry demands, LORD Corporation responded by developing a unique low-stress epoxy gel encapsulant - ES-100. This epoxy encapsulant provides an alternative option for customer applications with harsher demands such as resistance to high temperatures and chemicals.

Wang is responsible for the development and commercialization of new materials for the electronics market. With expertise in various areas including conductive materials, adhesives, underfills, potting and encapsulants, he has also served in a technical supporting role for the LORD electronics business. Having worked for LORD Corporation for 10 years, Wang has more than 20 years of combined industrial experience focused on adhesives, coatings and potting encapsulants for the electronics industry. Wang earned his Ph.D. in polymer science from Peking University.

About LORD Corporation

With global reach and extensive technical capabilities, LORD has the ability to work on complex formulations, balancing contradictory property and process requirements to deliver the solutions that meet customer and market demands. For the electronics industry, LORD serves as a diversified technology company providing high value-added materials to niche markets. LORD builds on its more than 80 year history with a track record of successful long-term partnerships with technology leaders in industries ranging from aerospace to automotive, electronics to industrial heavy equipment.

Founded in 1924, LORD Corporation is a privately-held company that designs, manufactures and markets mechanical devices and electromechanical systems to control vibration, motion and noise; formulates, produces and sells general purpose and specialty adhesives, coatings and electronic materials; and develops products and systems utilizing magnetically responsive technologies. With headquarters in Cary, N.C., and sales in excess of $720MM, LORD has manufacturing in nine countries and offices in more than 15 major business centers. LORD Corporation employs more than 2,700 worldwide.

Source: LORD Corporation

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