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Master Bond's Low-viscosity, Room-temperature Curing Epoxy Conforms to USP Class VI

Published on 2011-06-13. Author : SpecialChem

HACKENSACK, NJ -- Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.

Offering a forgiving 1 to 1 mix ratio by weight or volume, EP21LV cures at room temperature in 24 to 36 hours or faster at elevated temperatures. This system is unique in that the rigidity of its cure can be altered by adjusting its mix ratio. For example by adding more of Part A (for example, in a 2 to 1 ratio), users will get a more rigid cure with enhanced machinability. Switching to a 1 to 2 mix ratio yields a more forgiving cure with improved impact resistance.

Serviceable over the wide range of -65°F to +250°F, this epoxy features a long working life of 60 to 75 minutes for a 200 gram mass. EP21LV bonds well to a variety of substrates including metals, glass, wood, rubbers, ceramics and many plastics. It resists thermal cycling as well as water, oils, fuels, bases, acids and salts. EP21LV produces durable bonds with a tensile strength of 7,600 psi, a shear strength over 2,900 psi and an elongation of 4.8% at 75°F. This versatile two-component epoxy has a volume resistivity of 1015 ohm-cm and a coefficient of thermal expansion of 53 in/in x 10-6/ °C.

In addition to its standard amber-clear color, EP21LV is available in a wide variety of alternative colors. Parts A and B come in pint, quart, gallon and five gallon container kits.

Master Bond Electrically Insulative Epoxy Resin Systems

Developed for high performance bonding, sealing, coating, encapsulation, and casting, Master Bond's EP21LV combines exceptional electrical insulation properties with a low viscosity.

Source: Master Bond


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