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New PRESEAL™ compounds simplify manufacture and assembly of EMI RFI gaskets

Published on 2003-06-20. Author : SpecialChem


Premix Thermoplastics, Inc., announced the introduction of highly conductive, thermoplastic elastomers specifically formulated for EMI/RFI gasketing in the electronics industry. Called PRESEAL�, these new patent- pending, silicone-free compounds greatly simplify the manufacture and assembly of gaskets.

Unlike silicone compounds, which are thermoset, there is minimal wastage with PRESEAL� compounds. Any scrap can be reground and molded again. Designed for mass production, PRESEAL� compounds can be quickly and easily injection molded into complex shapes and sizes with consistent quality. They can also be extruded, or over-molded onto HIPS, ABS, PC/ABS, PC, and PPO-PS for molded-in gaskets. PRESEAL� compounds utilize silver as the conductive medium because it provides the highest EMI shielding. In addition to providing EMI shielding, the compounds can be used for grounding and shock absorption, and as a heat sink due to the relatively good heat conductivity. The new compounds have a volume resistivity of <0.01 ohm-cm, 100 dB shielding effectiveness, and <35% compression set.

In addition to PRESEAL� compounds, Premix manufactures other elastomers, utilizing electrically conductive additives, such as nickel or carbon, which can be customized to meet specific application requirements.

Premix Thermoplastics, Inc. is a wholly owned subsidiary of Premix, OY of Rajamaki, Finland. PRESEAL� compounds are the newest products in the company's EMI/RFI shielding, electrically conductive and static dissipative product mix.

Source: Premix Thermoplastics, Inc.

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