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New USP Class VI Approved Epoxy Adhesive Cures Rapidly at Room Temperature

Published on 2008-08-04. Author : SpecialChem

Hackensack, NJ -- Master Bond Inc has introduced a new high performance, low viscosity epoxy adhesive called EP41SMED for fast, room temperature curing, bonding applications. This compound has a 5 to 1 mix ratio by weight and has a "handling" time of as little as 10-15 minutes at ambient temperatures. Bonds are resistant to water, oil, and many organic solvents, as well as cold sterilants, ETO and gamma radiation. It fully meets USP Class VI requirements and conforms to Title 21, US Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for food applications.

low viscosity epoxy adhesive called EP41SMED

Master Bond EP41SMED contains no solvents or diluents. It has exceptionally low shrinkage upon cure. Bonds are rigid and offer excellent adhesion to a wide variety of similar and dissimilar substrates. These include metals, glass, ceramics, rubbers, wood and most plastics. Additionally, EP41SMED has superior electrical insulation properties.

EP41SMED is easy to apply and is available for use in pint, quart, gallon and 5 gallon container kits. It has a shelf life in original unopened containers of 6 months minimum.

Source: Master Bond Inc.


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