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Rohm and Haas introduces packaging solutions at two expos

Published on 2002-09-24. Author : SpecialChem

 

Rohm and Haas Co. will be participating in two packaging expos this fall. Major product introductions under the company’s “Total Packaging Solutions” program are planned during each exhibition. During Emballage 2002, in Paris (Booth R80 in Hall 5b), the company will feature its new Robond L water-based adhesives, Mor-Free solventless adhesives, and Adcote solvent-based adhesives. In Chicago during Pack Expo (Booth E 7913) the company will showcase new product offerings under its Robond L, Mor-Free and Adcote brands.

For more information: in North America, contact Linda Barker at 267-893-5678, or e-mail lbarker@ki-lipton.com; in Europe, contact Cristiana Grillo-Bontemps at 33 0 140 02 53 34 or e-mail cgrillo-bontemps@rohmhaas.com


FEICA 2018 European Adhesive and Sealant Conference and EXPO
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