Industry News

Toyochem to Present High-heat Resistant Single-sided Adhesive Tapes at JPCA Show 2016

Published on 2016-05-25. Author : SpecialChem

Tokyo, Japan -- Toyochem Co., Ltd., a wholly-owned subsidiary of the Toyo Ink Group, announced that they will be participating in JPCA Show 2016, or the 46th International Electronic Circuits Exhibition. The show will run from June 1 to 3 at the Tokyo Big Sight in Tokyo, Japan.

The aim of the JPCA Show is to contribute to the overall development of the electronic circuit industry and related fields by presenting an exhibition of products, knowledge and solutions for electronics devices, IT devices and equipment, and large electronics (printed electronics, stretchable electronics, etc.). Electronic circuit and packaging technology is used in all electronics and information and communication devices, having tremendous potential for widespread use in the future.

Foreseeing future demand, Toyochem, at this year’s JPCA, will spotlight its latest electronics-related materials based on Toyo Ink Group’s unique materials and processing technologies and propose solutions to meet the electronic engineering needs of its customers and end-users.
Toyochem to Present High-heat Resistant Single-sided Adhesive Tapes at JPCA Show 2016
Fig. 1: Toyochem at JPCA Show 2016

Visitors to the Toyochem booth 2E-08 can expect the LIOELM™ TSS™ series of electromagnetic shielding films, which are specially designed to meet strict shielding demands. The TSS™200 series of shielding films is suitable for use on rigid-flex boards due to its superior gap-fill properties. Also exhibits excellent adhesive on a wide range of gold-plated substrates for flexible printed circuits. The TSS™300 type is ideal for customers who require thin-type films with stable shielding results.

Component engineers looking for conductive sheets that ensure constantly high conductivity can find out more about Toyochem’s LIOELM™ TSC200 series of electrically conductive adhesive sheets. These sheets boast high resistance to solder reflow heat and embeddability, thanks to the conductive filler dispersed in a heat-resistant urethane adhesive resin developed by the company.

Toyochem’s LIOELM™ TCL500 / TSU™500 series of low dielectric materials will be highlighted at the booth. By using the company’s original low-dielectric resin, this material reduces transmission losses during high-speed transmissions. It also contributes to the widening of circuit interconnect lines and the narrowing of the distance between lines, resulting in greater freedom in integrated circuit design.

Toyochem will also spotlight its popular LIOELM™ LE series of high heat resistant, low tack, single-sided adhesive tapes. New to this year’s lineup are the LIOELM™ LE951, LE957L and LE959K heat-resistant protective films, which help to keep the adhesive strength of pressure-sensitive adhesives at a low level, even after heat is applied.

LIOELM™ LE831P-50BK high heat-resistant adhesive tapes for film splicing, LIOELM™ LE552 low-tack polyurethane-based protective tapes and prototypes of its heat-resistant, repositionable polyimide adhesive tapes.

Showgoers can also expect to see Toyochem’s mainstay products such as functional hard coat films and functional OCA (optically clear adhesive) sheets.

About Toyochem Co., Ltd.

Toyochem oversees the Toyo Ink Group’s Polymers and Coatings-related business segment as a core operating company. Headquartered in Tokyo, the company has two production facilities in Japan (Saitama and Hyogo prefectures). Based on the Toyo Ink Group’s polymer design technologies accumulated over a century of product development, Toyochem produces polymers, adhesive tapes, marking films and coatings for a wide array of fields.

Source: Toyochem

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