The Universal Selection Source: Adhesives Ingredients

Oct 10, 2017 | Product News

Master Bond’s New Two-component Toughened Epoxy Features Enhanced Dimensional Stability

Master Bond has developed EP110F8-5, a toughened two component epoxy for potting & sealing, applications. It features superior electrical insulation properties ideal for applications where...

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Aug 30, 2017 | Product News

New One-component Epoxy for Die Attach Applications by Master Bond

Master Bond has developed EP17HTDA-1, a one component epoxy that can also be used for bonding and sealing. It has the ideal viscosity and flow for die attach applications. It has a high glass...

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Jul 17, 2017 | Product News

Room Temperature Curing Epoxy for Bonding & Sealing Applications: Master Bond

Master Bond has developed EP39MAOHT, a room temperature epoxy curing system. The system is used for demanding bonding, sealing, coating, potting and encapsulation applications. It combines...

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May 16, 2017 | Product News

Master Bond Develops Two Component, Low Viscosity Epoxy for Potting Small Components

Master Bond has developed EP62-1BF, a two part epoxy featuring the ability to withstand exposure to aggressive chemicals. EP62-1BF is easy to handle with a long open time of 12-24 hours at 75°F for...

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Feb 21, 2017 | Product News

Master Bond Develops Low Viscosity Epoxy for Potting and Encapsulation

Master Bond has developed EP30LP-2, a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This...

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Sep 19, 2017 | Product News

Master Bond Develops One Part Epoxy for Structural Bonding Applications

Master Bond has developed EP13LTE, a one part epoxy for structural bonding applications. The product features a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C...

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Aug 8, 2017 | Product News

Master Bond’s Newly Developed One-component Elastomeric Compound Meets ISO 10993-5 Specifications

Master Bond has developed X21Med, a single component elastomeric compound. It is a solvent-based system that is easy to apply and process. The product passes ISO 10993-5 tests for cytotoxicity...

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Jun 27, 2017 | Product News

Master Bond Develops Fast Curing Two-Part Epoxy for Bonding & Sealing Applications

Master Bond has developed EP41S-F, a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and...

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Mar 24, 2017 | Product News

Master Bond Develops One Part, Toughened Epoxy System for Dam-and-fill Encapsulation

Master Bond has developed one part epoxy system: Master Bond Supreme 3HTND-2DM for use in the dam-and-fill method for chip-on-board encapsulation. Master Bond Supreme 3HTND-2DM is a rapid curing...

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Jan 31, 2017 | Product News

Master Bond Unveils EP30TC, a 2C Epoxy for Potting & Sealing Applications in Aerospace

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains robust thermally conductive filler with very fine particle sizes. This NASA...

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