Aug 28, 2023 | Product News
HERMA launches 72Gpw, a wash-off label adhesive that offers approximately double the initial adhesion of standard wash-off adhesives with an equally high final adhesion and above all equally good...
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Wausau Coated Products (WCP) launches wash-away adhesive solution WA-769. The new adhesive is an emulsion acrylic permanent adhesive with good initial tack and adhesion to most surfaces. WCP is...
Aug 23, 2023 | Product News
GluECO Adhesives has received the U.S. Department of Agriculture (USDA) certified biobased product label for BondAmaize™ Adhesives. According to the company, BondAmaize™ has been certified as...
Aug 22, 2023 | Product News
H.B. Fuller Company to showcase consumer packaging innovations at PACK EXPO Las Vegas at the Las Vegas Convention Center from September 11 to 13, 2023. Below is a preview of several of the products...
Aug 21, 2023 | Product News
G6 Materials Corp. launches a thermally conductive G6-EPOXY® product line for sealing applications. The first new product is named “G6E-TSHV” and is a high thermally conductive, non-electrically...
Aug 15, 2023 | Product News
Sika’s SikaBond®-T100 get nominated for GreenStep 2023 Product Award. SikaBond®-T100 is an all-in-one hybrid polyurethane adhesive that provides bonding capabilities and holds an impressively...
Aug 14, 2023 | Product News
Henkel expands its portfolio for wearables in healthcare applications and showcased its portfolio at the 44th Wearable Technologies Conference 2023 USA held from August 1-2, 2023, in Fort Mason...
DIC Corporation launches MEGAFACE™ EFS series of environment-friendly surfactants that deliver a performance rivaling that of conventional fluorosurfactants despite not containing perfluoroalkyl and...
Aug 8, 2023 | Product News
RAMPF Polymer Solutions launches RAKU® PUR 49-6006 Black, an elastomer sealing adhesive for the automotive, battery and filter industries. RAKU® PUR 49-6006 Black combines elastic bonding and...
Aug 7, 2023 | Product News
Panacol launches Structalit® 5604, an extremely fast-curing adhesive which is specifically developed for bonding SMDs to printed circuit boards. The adhesive is based on epoxy resin and is, despite...