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Adhesives Ingredients

Oct 5, 2018 | Product News

Dow Launched Silicone-based Fast Cure Sealants for Glass Façades

Dow exhibited 50+ years of silicon-based technology, innovation and proven performance of its DOWSIL™ branded solutions at the Windows, Doors and Façades Show in Dubai. Dow introduced Ultra-Fast...

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Oct 4, 2018 | Product News

Evonik Launches Low-odor Thermally Stable Diluent for Adhesive Formulations

Evonik has launched VISIOMER® GLYFOMA (glycerol formal methacrylate), an exceptionally low-odor reactive diluent. Thanks to its low vapor pressure, it can be used anywhere low-VOC properties are...

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Oct 2, 2018 | Product News

Panacol Launches Heat Conductive Epoxy Adhesive for Electronics

New outstanding adhesives in Panacol´s product line are the thermosetting, one-component epoxy resin adhesives with very good heat-conducting properties and very high metal adhesion. These adhesives...

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Oct 1, 2018 | Product News

Dow Launched Acrylic Adhesive for Pressure Sensitive Labels at LabelExpo

Dow has announced the launch of ROBOND™ PS 7735, an all-temperature acrylic PSA and a novel Solvent-less Release Modifier technology, SYL-OFF™ SL25 Release Modifier, at LabelExpo Americas 2018 in...

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Sep 28, 2018 | Product News

DELO Develops High-temperature Stable Structural Epoxy Adhesive

DELO has developed a new Epoxy adhesive that achieves up to three times the strength of its predecessor products at high temperatures. DELO MONOPOX HT2860 can also be inductively cured, which...

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Sep 24, 2018 | Product News

Novel SIS Polymers for Oil Free Hot Melt Labels: TSRC/Dexco at FEICA 2018

TSRC/Dexco has developed novel SIS polymers that will help the hot melt adhesive formulator meet these upcoming challenges. Paul Dalley, Principal Scientist at Dexco Polymers shared these polymers...

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Sep 20, 2018 | Product News

AkzoNobel Showcased Innovative Polymer Technology for Sealants at FEICA

AkzoNobel exhibited at the FEICA 2018 with its innovative technologies for adhesives and sealants. The product range included Thioplast™ G polymer technology which includes epoxy-based polymers also...

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Sep 20, 2018 | Product News

BorsodChem Group Exhibited its Range of Polyurethane Raw Materials at FEICA 2018

The Wanhua & BorsodChem group was present at the European Adhesive and Sealant Conference & Expo, organized by FEICA in Riga, Latvia as an exhibitor with its range of polyurethane raw material...

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Sep 19, 2018 | Product News

Rain Carbon Presents Low Emission Hydrogenated Resins at FEICA

Rain Carbon Inc. has unveiled its upcoming line of hydrogenated resins – “NOVARES pure®” – at FEICA. The new “water-white” resins will be available in the third quarter of 2019, following completion...

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Sep 14, 2018 | Product News

Creative Materials Introduces Electrically Conductive Epoxy Adhesive

Creative Materials has introduced GPC-251/CA-414, a room temperature curing, two component electrically conductive epoxy adhesive for making electrical and mechanical attachments on electrical...

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