Feb 4, 2019 | Product News
The groundbreaking dry adhesive product, based on biomimicry research studies at the University of Akron, consists of millions of solid, sub-micron-diameter nanofibers that interact with microscopic...
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Feb 1, 2019 | Product News
Sun Chemical has launched EPICLON® HP 4770, a multi-functional naphthalene epoxy resin for formulators and engineers in the aerospace, transportation and electronics industry who seek to increase...
LANXESS will showcase low free (LF) isocyanate technology. LANXESS Urethane Systems has developed unique pre-polymers that are used for hot melt adhesives in the automotive, construction and...
Jan 29, 2019 | Product News
The Scott Bader stand showcased their range of Crestabond® MMA structural adhesives aimed at manufacturers looking for proven, high performance gap filling and structural bonding solutions across a...
Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements. It can be used for bonding, sealing & coating and has good flowability with a...
Jan 21, 2019 | Product News
Avantor® has announced that it will highlight its NuSil™ brand biocompatible silicone adhesives and other technologies at MD&M West 2019, February 5-7 in Anaheim, Calif. The advanced silicone...
Jan 18, 2019 | Product News
Elkem Silicones will be present at MD&M West 2019 in Anaheim, CA February 5-7 with the exciting new product innovations and full range of medical grade silicones...
Ampacet has introduced Seablock 4S, an additive for biaxially-oriented polypropylene film (BOPP) that offers excellent anti-block properties without scuffing as well as consistent low slip...
Jan 17, 2019 | Product News
Wanhua & BorsodChem group will represent at Polyurethanex exhibition on raw materials, equipment and technologies for polyurethane at the Expocentre Fairgrounds, in the center of Moscow, Russia. The...
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and...