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Aremco Unveils Aremco-Bondâ„¢ 2315, an Epoxy-potting Compound for Electronics

Published on 2015-03-27. Author : SpecialChem

Aremco-Bond™ 2315, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications to 365 ºF (185 ºC).

Aremco-Bond™ 2315 is a low viscosity, black-pigmented, high temperature, epoxy compound used in electrical and electronic applications to 365 ºF (185 ºC). Additional features include high thermal conductivity, good electrical insulation, and low shrinkage after cure.

Aremco-Bond™ 2315 provides high flexural strength of 12,300 psi. Electrical properties include a volume resistivity of 1.0 x 1015, dielectric strength of 480 volts/mil, and dielectric constant of 4.7 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond™ 2315 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 25 parts hardener by weight. Mixed viscosity is 3,000 cP and the pot life for a 100 gram mass is greater than 8 hours at room temperature. Recommended cure is 2 hours at 160 ºF plus 2 hours at 300 ºF. Alternative cure is 6 hours at 250 ºF. Cured product exhibits a linear shrinkage of .003 in/in and Shore-D hardness of 92.

Aremco-Bond™ 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors.

About Aremco
Aremco’s advanced material division is a leader in the development and production of technical ceramics, adhesives, coatings, sealants and potting compounds for applications to 3200 ºF. These materials are used throughout industry in the design of sensors, electrical components and analytical instruments. Industries served include automotive, aerospace, chemical processing, metallurgical, power generation and semiconductor.

Source: Aremco
 


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