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Aremco Unveils Aremco-Bond™ 556-HTHC, a Silver-filled Epoxy for Hybrid Packaging & more

Published on 2013-12-10. Author : SpecialChem

Aremco-Bond™ 556-HTHC, a new silver-filled, highly electrically conductive, high temperature epoxy developed by Aremco Products, Inc., is now used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 480 °F (250 °C).

 Aremco-Bond™ 556-HTHC is an advanced, two-part, electrically and thermally conductive, high temperature epoxy formulated using a high purity silver flake. This adhesive exhibits an exceptionally low volume resistivity of less than 0.0001 ohm-cm at room temperature and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 390 °F (200 °C) and intermittent use temperature is 480 °F (250 °C). The tensile shear strength is 1,700 psi and Shore D hardness is 90. Viscosity range is 40,000 to 45,000 cP.

Aremco-Bond™ 556-HTHC mixes easily in a 100-to-2 resin-to-hardener ratio by weight. It cures in 2 hours at 200 °F or in 1 hour at 250 °F. It comes in standard 50-gram kits and can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.

Typical applications for Aremco-Bond™ 556-HTHC include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

About Aremco

Aremco's advanced material division is a leader in the development and production of technical ceramics, adhesives, coatings, sealants and potting compounds for applications to 3200 °F.

Source: Aremco-Bond


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