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Aremco Unveils Aremco-Bond™ 860, a Thermally Conductive Epoxy System

Published on 2012-10-01. Author : SpecialChem


Aremco-Bond™ 860, a new high temperature, aluminum nitride filled, thermally conductive, electrically insulating epoxy system developed by Aremco Products, Inc., is now used for electrical and electronic bonding applications to 400 °F (204 °C).

Aremco-Bond™ 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding and small encapsulation applications to 400 °F (204 °C). Aremco-Bond™ 860 exhibits excellent adhesion to a variety of high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals.

Aremco-Bond™ 860 is mixed in a ratio of 1 part base resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200 °F. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft2-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection and thermal shock resistance.

Typical applications for Aremco-Bond™ 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bond™ 860 is supplied in pre-measured pint, quart, gallon and five gallon kits from stock.

About Aremco

Aremco Formed in 1965, Aremco's advanced materials division has been a leader in the development and production of technical ceramics, adhesives, coatings, sealants and potting compounds for applications to 3200°F. These materials are used throughout industry in the design of sensors, electrical components and analytical instruments, as well as the maintenance and repair of high temperature process equipment.

Source: Aremco

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