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Bostik to Showcase Range of HMAs and Labeling Solutions at LABELEXPO Americas

Published on 2018-09-13. Author : SpecialChem

TAGS:  Hot-melt Adhesives     UV/EB Cure Adhesives    

Bostik will be present at its booth, #455, at the Labelexpo Americas tradeshow, September 25 through 27, at the Donald E. Stephens Convention Center in Chicago. Labelexpo attendees will have the opportunity to learn about Bostik’s latest tape and label technologies, including e-commerce solutions and durable labels, in addition to Arkema Coating Resins.

Bostik’s Linerless Labels and Hot Melt Solutions for Packaging

bostik-HMA-labelexpo
Bostik plans to showcase linerless labels and hot melt solutions
for packaging substrates at LABELEXPO AMERICAS 2018

Bostik plans to showcase its e-commerce innovations, including linerless labels and hot melt solutions for various packaging substrates and label stocks. The shipping label and packing slip adhesives are able to bond to polybags, pallet stretch wrap films, recycled content substrates and other materials, even in extreme temperatures and warehouse conditions. They offer a thinner label construction and can increase application speeds, leading to cost savings.

Multiple Adhesive Range from Bostik and Arkema on Display


Also featured in Bostik’s Labelexpo booth will be Arkema Coating Resins, which is part of the Arkema Group. Arkema’s ENCOR® adhesive latex family of products for permanent or removable paper or filmic labels offers a range of tack, peel and cohesive strengths in a coater-ready form. In addition, Arkema’s 100% solids UV or EB curable adhesives deliver excellent adhesion to a variety of substrates and a balance of adhesive properties.

The Bostik booth will also exhibit durable label adhesives, which adhere strongly to metal drums, batteries and low energy surfaces, even in the presence of high and low temperatures, battery acid and more. With these adhesives, labels can clearly display information despite extreme conditions.


Source: Bostik
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