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DELO Introduces Die-attach Adhesive for Chip Attachment Applications

Published on 2020-08-19. Author : SpecialChem

TAGS:  Epoxy Adhesives    

DELO Introduces Die-attach Glue for Chip Attachment Applications DELO launches DELO MONOPOX EG2596, a die-attach adhesive for chip attachment to semiconductors and surface component mount (SMT) applications. It is a heat-cure, one-component epoxy resin. The new adhesive is designed to replace the DELO MONOPOX MK096.

High Strength Adhesive with Precise Application

DELO MONOPOX EG2596 is characterized by high resistance, even after aging, and precise application. The characteristics has been demonstrated in tests carried out in conjunction with plant builders ASM Assembly Systems, a global manufacturer of SMT placement machines. The fluorescent adhesive is suitable for long term use for many applications.

DELO MONOPOX EG2596 exhibits 150 percent higher strength after seven days of storage at 85 percent relative humidity and a temperature of +85 °C. The adhesive retains strong adhesion even after typical aging tests such as the MSL1 test performed according to the Joint Electron Device Engineering Council (JEDEC) standard. Using 1 x 1 mm² silicon chips, the tests achieved high withstand values of 47 N on the FR4 substrate and 62 N on gold.

High Thixotropy Index with Stable Dimensions

DELO MONOPOX EG2596 has high thixotropy index of ~ 9. The higher the index, the more stable the product remains after application. High thixotropic properties of DELO MONOPOX EG2596 allow the adhesive to be applied very finely while benefiting from a fluid state directly at the outlet of the metering valve. After dosing, the viscosity increases again within fractions of a second, preventing the adhesive from spreading. This allows micro-droplets to be formed in a controlled fashion, without the adhesive spreading into areas that need to be left free. Even during heat curing, the adhesive drop remains extremely dimensionally stable.

The flow properties of DELO MONOPOX EG2596 make it compatible with drop-in or needle-through dispensing. The flexibility allows the adhesive to cover a wide range of applications. Tests conducted jointly by DELO and its technology partner, ASM Assembly Systems demonstrate the excellent dosing properties of the Die-Attach adhesive.

One of the devices used is the "Glue Feeder", which has a throw and allows contactless and upside-down application of the adhesive. The adhesive is applied directly to the component and not to the circuit board, a solution that guarantees fast and very precise processes. Depending on the dosing equipment, it is possible to obtain drops smaller than 250 µm. Even after several rounds of dispensing, the dosage qualities remain uniform and do not exhibit typical side effects such as satellite droplets.

Polymerization takes place at +130°C in 10 minutes. The adhesive is fluorescent for optimal detection. It is available in 10 cc cartridges. Once opened, the product can be used for seven days at the standard working temperature of + 23°C.

Source: DELO
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