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DELO Launches Liquid Acrylic- and Epoxy-based PSAs for the Electronics Industry

Published on 2020-11-09. Author : SpecialChem

TAGS:  Acrylic Adhesives      Epoxy Adhesives      UV/EB Cure Adhesives    

DELO Launches Liquid Acrylic and Epoxy PSA for the Electronics Industry DELO launches two liquid pressure-sensitive adhesives DELO PHOTOBOND PS4130 and DELO KATIOBOND PS6372, for the electronics industry. The adhesives have similar properties to (double-sided) adhesive tapes but are applied in liquid form. The property helps users save time and costs in the production process. The adhesives are particularly suitable for electronic applications such as smartphone speakers or display frames.

High-peel Resistant with Short Cycle Time


Depending on the requirements, users can choose liquid pressure-sensitive adhesives with different chemical bases. The acrylate-based adhesive DELO PHOTOBOND PS4130 has very similar properties to typical adhesive tape in terms of flexibility, peel resistance and strength. The adhesive is particularly suitable for applications with short cycle times and moderate requirements on final strength. DELO PHOTOBOND PS4130 is already being used in the assembly of smartphone speakers due to its damping properties and low outgassing values.

The epoxy-based adhesive DELO KATIOBOND PS6372 was developed specifically for structural bonding applications requiring high strength. Once the initial strength has been achieved by pressing on the components, the assembly can be processed immediately, with the strength of the bonded joint increasing afterwards. When fully cured, DELO KATIOBOND PS6372 achieves compression shear strengths of over 30 MPa on aluminum and over 10 MPa on FR4. Its high resistance to temperature and media makes it also suitable for automotive applications.

Adhesives Suitable for Fully Automated Processes


The liquid pressure-sensitive adhesives are dispensed in liquid form directly onto the component and then irradiated by UV light. The UV light creates a tacky surface, which is characteristic for tapes. Since the adhesive reaches its initial strength immediately after the second component is pressed on, the bonded assembly can be processed directly and without any fixing devices. This is a great advantage over many standard liquid adhesives.

The entire process, from precise dispensing on tiny components or three-dimensional geometries to irradiation and mechanical pressing, can be fully automated. This property makes the liquid pressure-sensitive adhesives particularly suitable for high-output production.


Source: DELO
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