Dow has been recognized by the Business Intelligence Group™ with the 2022 BIG Innovation Awards. This honor is awarded to organizations and people who bring new ideas, big or small, to life. Dow received the award for its DOWSIL™ TC-2035 CV Adhesive.
Low-temperature, Fast Cure Adhesive
DOWSIL™ TC-2035 CV Adhesive is a new high thermal conductivity product 3.3 W/mK with low temperature, fast cure, and outstanding room temperature shelf-life stability for automotive electronics assembly applications.
This technology enables low carbon mobility and was designed to provide long term bonding and efficient thermal flow, especially where low bond line thickness is required to enhance thermal conductivity.
Primer-less Adhesion for Automotive
With TC-2035’s outstanding 12 months shelf-life at or <35°C, primer-less adhesion on selected substrates and low volatile content <100 ppm, the innovative adhesive can be used for automotive applications including Advanced Driver Assistance Systems (ADAS), ECU assembly, power electronics, converter/inverter and OBC.
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The award speaks to Dow’s continued ability to collaborate and innovate to deliver solutions that benefit our stakeholders and our planet. It is satisfying to see the hard work of teams recognized for delivering top innovative product technologies that enable sustainable growth across markets and a broad range of applications,” said Jim Helwick, global director for research and development for Dow Consumer Solutions.
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I look forward to the continued success of our teams throughout the year by working closely with our customers and leveraging the materials science leadership of Dow,” added Helwick.
Source: Dow