TAGS: Epoxy Adhesives
Dymax Corporation, a manufacturer of rapid light-curing materials and equipment, introduces Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly applications.
Low-volumetric Shrinkage with Thermal Stability
Low Shrink™ OP-81-LS has low-volumetric shrinkage during cure, low CTE for stability through thermal excursions, and meets ASTM E595 outgassing requirements. The epoxy is ideal for positioning and bonding of lenses, prisms, fibers or other optical components. The epoxy does not react until exposed to light, so manufacturers have time to accurately align parts before assembly and cure.
The epoxy features a low temperature (80-85°C) heat-curing function in applications where shadow areas exist or where heat-cure only is preferred. The material is solvent-free and one component, requiring no mixing. Low Shrink™ OP-81-LS is designed to bond dissimilar substrates, including polycarbonate, glass, acrylic, and metallic surfaces, and is well suited for use in consumer electronics applications.
Source: Dymax Corporation