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Fluon EA-2000 PFA Adhesive Resin from AGC Chemicals Enables One-step Processing

Published on 2017-10-16. Author : SpecialChem

Fluon® PFA EA-2000 resin from AGC Chemicals Americas Inc. features a built-in functional adhesive group that enables one-step processing with other polymers and metals. This resin also eliminates the need for surface treatment or a separate adhesive layer.

Fluon EA-2000 PFA Adhesive Resin from AGC Chemicals Enables One-step Processing
Fluon EA-2000 PFA Adhesive Resin from AGC Chemicals
Enables One-step Processing
Fluon EA-2000 PFA resin is ideal for coating and protecting printed circuit boards because it provides enhanced electrical characteristics, in addition to heat and chemical resistance. Other applications include interposers, steel plate laminates, heat-resistant insulating tape and heat-resistant laminated tubing.

Non-stick Properties


This resin also exhibits excellent non-stick properties, low frictional properties, water and oil repellency, a low dielectric constant and low dissipation factor.

Fluon® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates adhesion to other materials in a one-step process, without the need for surface treatment or a separate adhesive layer. Example materials include glass cloth, polyimide, or various metals.

This grade is semi-commercialized and may be available upon request. This material is supplied as pellets and packaged in 25kg plastic bags.

Features of EA-2000


  • Heat resistance to 260C and superior chemical resistance, equivalent to conventional PFA materials 
  • Adhesion to other polymers and metals without the use of surface treatment or a separate adhesive layer via a traditional melt-processable method. 
  • Excellent non-stick properties, low frictional properties, and water and oil repellency (high contact angle) 
  • Low dielectric constant (2.1) and low dissipation factor (0.001) 

Assumed Applications of EA-2000


  • Printed circuit boards (rigid or flexible) 
  • Heat-resistant insulating tape 
  • Heat-resistant laminated tubing 
  • Interposers 
  • Steel plate laminates 

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Source: AGC Chemicals
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