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Henkel Introduces Thermally Conductive Gap Filling Adhesive for Automotives

Published on 2020-06-30. Edited By : SpecialChem

Henkel Introduces Thermally Conductive Gap Filler Adhesive for Automotives Henkel introduces Bergquist Gap Filler TGF 7000, a silicone-based, two-part, liquid gap filling thermal interface material (TIM) for automotive electronics and power conversion electronics. The liquid gap filling adhesive offers high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 grams per second.

Low Carbon Footprint with High Power Design


Bergquist Gap Filler TGF 7000 is suited for applications, such as automotive advanced driver-assistance systems (ADAS) systems, power conversion systems, electric pumps and engine control units (ECU). The gap filling adhesive is ideal for places where mass production, reliability and high thermal conductivity are required for smaller carbon footprint and higher power designs.

From a chemistry perspective, engineering a liquid TIM with substantive filler content that also allows fast dispensing is an exceptionally difficult balance to achieve. One might expect a liquid material with high thermal conductivity to experience separation, settling, caking and clogging of the dispensing equipment, but Bergquist Gap Filler TGF 7000 exhibits none of these issues,” explains Holger Schuh, Henkel Global Technology Expert.

Compatible with Various Bonding Surfaces


Bergquist Gap Filler TGF 7000 cures at room temperature and remains soft upon cure to minimize stress. The product has controlled volatility with siloxane content below 300 parts per million (ppm) to provide compatibility with various bonding surfaces and optical components. Also, the gap filler offers storage stability and easy handling.

High-performance liquid gap fillers set high requirements on the dispensing technology; to ensure a precise application without raising the working pressure or to engineer a durable resin circuit that can cope with high-abrasive fillers. With screw pumps and static mixing system Duplex+, we can set up a high-volume dispensing process with excellent cmk-results and cycle times”, said Florian Schütz, Regional Sales Manager DACH from Bdtronic.

Henkel has engaged with Zentrum für Wärmemanagement (ZFW) Stuttgart, an industry research firm to evaluate Bergquist Gap Filler TGF 7000 within various stress environments.

For next-generation automotive designs where form and function are inherently linked, smaller, high-power components are enabling lighter, sleeker and more sophisticated vehicles,” added Schuh.


Source: Henkel
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