Indium Corporation launches InTACK™, a drop-in adhesive solution for power module assembly at PCIM Europe. InTACK™ is a no-clean, no residue, a halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
High-tack with Tool-free Adhesive
Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high-tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
InTACK™ has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.
Offers High-quality Solder Performance
InTACK™ technology is specifically designed to achieve high-quality solder performance with no residue in flux-free reflow techniques commonly used in power module assembly.
Benefits of InTACK™ include:
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Maintains precise assembly alignment
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Compatible with solder preforms, dies, and power module components
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Robust tacking and long working time
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Optimal performance in formic acid/vacuum reflow
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No residue, no cleaning
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Dispensing application tested and process proven
PCIM Europe is being held from May 10-12 in Nuremberg, Germany.
Source: Indium Corporation