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Adhesives Ingredients
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Adhesives Ingredients
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Indium Corporation Launches Adhesive for Semiconductor Applications

Published on 2022-05-02. Edited By : SpecialChem

Indium Corporation Launches Adhesive for Semiconductor ApplicationsIndium Corporation launches InTACK™, a drop-in adhesive solution for power module assembly at PCIM Europe. InTACK™ is a no-clean, no residue, a halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.

High-tack with Tool-free Adhesive

Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high-tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.

InTACK™ has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.

Offers High-quality Solder Performance

InTACK™ technology is specifically designed to achieve high-quality solder performance with no residue in flux-free reflow techniques commonly used in power module assembly.

Benefits of InTACK™ include:

  • Maintains precise assembly alignment
  • Compatible with solder preforms, dies, and power module components
  • Robust tacking and long working time
  • Optimal performance in formic acid/vacuum reflow
  • No residue, no cleaning
  • Dispensing application tested and process proven

PCIM Europe is being held from May 10-12 in Nuremberg, Germany.

Source: Indium Corporation
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