TAGS: Epoxy Adhesives
Master Bond has launched electrically conductive EP17HTS-DA, a one component, no mix and die attach epoxy adhesive system withstanding high temperatures.
Low Volume Resistivity with High Temperature Resistance
EP17HTS-DA has robust strength profile with a die shear strength of 35-40 kg-f at room temperature. The new adhesive meets NASA low outgassing specifications and the service temperature extends from -80°F to 550°F. The adhesive system has a low volume resistivity of less than 0.005 ohm-cm and performs well as a heat conductor.
This specialty formulation maintains a high Tg of 140-150°C and passes MIL-STD-883J thermal stability requirements at 200°C.
Easy-to-Use Epoxy Adhesive System
EP17HTS-DA is a thixotropic paste that can be easily dispensed manually or through automated dispensing systems. The compound is not premixed or frozen and has an unlimited working life at room temperature. The adhesive system requires a heat cure of 300°F for two to three hours, followed by post curing at 350°F for one to two hours.
The product bonds well with many substrates, such as metals, ceramics and plastics. The adhesive system is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 g to several pounds.
Source: Master Bond