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Master Bond Develops One Part, Toughened Epoxy System for Dam-and-fill Encapsulation

Published on 2017-03-24. Author : SpecialChem

Master Bond has developed one part epoxy system: Master Bond Supreme 3HTND-2DM for use in the dam-and-fill method for chip-on-board encapsulation.

Master Bond Develops One Part, Toughened Epoxy System for Dam-and-Fill Encapsulation
Master Bond Develops One Part, Toughened Epoxy
System for Dam-and-Fill Encapsulation

Master Bond Supreme 3HTND-2DM

Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds.

One method is referred to as glob top, where the encapsulating system is dispensed and applied directly to the area to be protected. The dam-and-fill method entails dispensing the damming material around the area to be encapsulated.

Encapsulating Material

This material will cure in place and will not run, in essence forming a dam. Then an encapsulating material is applied to cover the remaining area to be protected. This system can be cured in thicknesses up to ¼ inch.

  • Supreme 3HTND-2DM passes ASTM E595 specifications for NASA low outgassing enabling it to be used in vacuum, aerospace, electro-optic and other related applications. 
  • This high performance compound bonds well to a wide variety of substrates used in electronics including silicon and other semiconductors, metals, ceramics and many plastics. 
  • Most importantly, Supreme 3HTND-2DM has enhanced dimensional stability and has a tensile strength of 6,000-7,500 psi at room temperature.
  • It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH.

As a toughened system, Supreme 3HTND-2DM resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 10-11 BTU. This epoxy withstands exposure to water and chemicals such as acids, bases, fuels and a number of common solvents. It is considered to have to have low ionic levels of chlorine, sodium and potassium (less than 10 ppm).

About Master Bond

Master Bond Inc. was founded in 1976. Its focus has been on developing the best in epoxies, silicones, polyurethanes, polysulfides, UV cures and other specialty adhesive systems. It is true specialist in its field and is recognized by many as the preeminent adhesive formulation company in the world.

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Source: Master Bond
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