OK
The Universal Selection Source:
Adhesives Ingredients
Product News

Master Bond Unveils EP36AO for Electrical Potting and Encapsulation Applications

Published on 2012-06-22. Author : SpecialChem

HACKENSACK, NJ -- Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties.

EP36AO
Master Bond EP36AO

Serviceable over the wide temperature range of -80°F to +500°F, EP36AO provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 volts/mil, a volume resistivity of 2-3 x 1012 ohm-cm and thermal conductivity of 9-10 BTU•in/ft2•hr•°F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi. EP36AO is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.

As a one component system, EP36AO doesn't require any mixing and offers the convenience of flexible cure schedules. A typical gel time is 30 minutes at 180°F, with full cures attained in 2-21/2 hours at 300°F. This can be shortened further at higher temperatures. EP36AO will retain its liquidity as long as the temperature does not exceeed 180°F. It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container. EP36AO is available in pints, quarts, gallons and five gallon containers. It is now also available in conveniently prepared 30 gram cookies.

Master Bond Thermally Conductive Compounds

Designed for demanding electrical, bonding, coating, potting and encapsulation applications, Master Bond EP36AO offers high temperature resistance, thermal conductivity, electrical insulation and flexibility.

Source: Master Bond


Improve your performance with water soluble epoxy compounds
Back to Top