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Master Bond Unveils MasterSil 972TC-LO, a Thermally Conductive 2-part Silicone for Bonding

Published on 2015-11-24. Author : SpecialChem

Master Bond MasterSil 972TC-LO passes the rigorous requirements for low outgassing per ASTM E595 specifications. It is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronics, opto-electronic and specialty OEM industries. This two part silicone system offers convenient handling for bonding, sealing, coating and potting.

MasterSil 972TC-LO
Fig. 1: MasterSil 972TC-LO

MasterSil 972TC-LO is an electrically insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)]. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of and plastics. Highly flexible, MasterSil 972TC-LO has an elongation of 40-80%, withstands aggressive thermal cycling and resists mechanical shock. This heat dissipative silicone system has a wide service temperature range is -120°F to +400°F.

This addition cured system does not require air for cross-linking. It features low shrinkage upon curing even in thick or wide cross sections. MasterSil 972TC-LO has a moderate viscosity of 30,000-40,000 cps with good flow properties and has a one to one mix ratio by weight. It has a long working life of 6-10 hours at room temperature. This compound is 100% solids and has a white color. Mastersil 972TC-LO is available in 50 gram syringe kits with additional sizes upon request.

About Master Bond

Master Bond Inc. formulates the highest quality products and offers unmatched technical advice and customer support. Its product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. The company offers replacements for competitors' discontinued products.

Source: Master Bond

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