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Master Bond Unveils Epoxy-based, Dual Curing Adhesive for Bonding & Sealing Applications

Published on 2018-01-09. Author : SpecialChem

TAGS:  Sealants      Epoxy Adhesives      UV/EB Cure Adhesives    

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.

UV22DC80-10F
Master Bond Unveils UV22DC80-10F
Rohit Ramnath, Senior Product Engineer:

“It is designed to cure in 10-30 seconds at 365nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~ 80°C) for 30-60 minutes. This system has been specially designed for applications involving heat sensitive components. The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems.”

Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. The product can be used for bonding, sealing, coating and glob-top type applications. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.

Master Bond Dual Cure Adhesives


Master Bond UV22DC80-10F is a one part dual UV and heat cure system with unique flow characteristics. It features optical clarity, excellent bond strength, thermal stability and convenient, easy application.

Key Features


  • Thixotropic low viscosity
  • Minimal shrinkage upon curing
  • Superb optical clarity
  • Cures at 80°C in shadowed out areas

Product Advantages


  • One component system; no mixing needed
  • Dual curing mechanism allows for curing in shadowed out areas and rapid fixturing time at 80°C
  • No oxygen inhibition
  • Very low shrinkage upon curing
  • Superior physical strength and temperature resistance
  • Nano filled, high dimensional stability
 


Source: Master Bond
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