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ROARTIS' New Fast-cure Anisotropic Conductive Adhesive for Printed Electronics

Published on 2020-07-03. Edited By : SpecialChem

ROARTIS New Anisotropic Conductive Adhesives for Printed ElectronicsROARTIS BV launches IQ-BOND 5976-ACE, a fast-cure anisotropic conductive adhesive for printed electronics application. The adhesive is used in the assembly of fine pitch radio-frequency identification (RFID) antennas to interconnect the RFID tab onto the RFID antenna.

High-adhesion Strength on Various Flexible and Rigid Substrates

IQ-BOND 5976-ACE addresses the economic challenges of printed electronics by combining high throughput processing requirements with long-term reliability requirements. The adhesive provides high-adhesion strength on different flexible and rigid substrates, such as polyethylene terephthalate (PET), polyimide, FR4, copper, aluminum and silver. IQ-BOND 5976-ACE is moisture tested at 85°C/85%RH for 1000 hours and temperature cycle tested at -40°C/+125°C.

The adhesive cures within seconds with thermode- or induction curing systems, enabling to assembly 20.000 – 40.000 microchips per hour on typical, industrial and flip-chip production systems.

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