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Adhesives Ingredients
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Momentive Offers Thermally Conductive Gap Filling Adhesive

Published on 2020-06-23. Author : SpecialChem

Momentive Introduces Thermally Conductive Gap Filling AdhesiveMomentive offers launched SilCool* TIA241GF, a silicone thermally conductive gap filling adhesive, to be distributed by Techsil. SilCool* TIA241GF is ideal for applications that requires heat transfer, low stress, and good interface wetting. The product offers tacky adhesion for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and CTE (coefficient of thermal expansion) mismatch.

Reliable Adhesion with Thermal Resistance

The thermal gap filling adhesive is a two-part, soft, thermally conductive silicone material. The non-slumping pasty consistency of the adhesive offers physical stability for optimized processing. SilCool* TIA241GF can be used as liquid dispensed alternative to prefabricated thermal pads, for a broad array of thermal designs in electronic applications.

SilCool* TIA241GF offers reliable adhesion and thermal resistance over competing materials. The gap filling adhesive can be used for automotive applications (e.g. automotive electronic control units and systems) and as a thermal interface for electronic components in automotive, consumer, telecommunication, lighting and industrial devices.

Key Features and Benefits of SilCool* TIA241GF

  • Good thermal conductivity 4.1 W/mK
  • Fast and low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retains softness after cure to contribute to stress relief during thermal cycling
  • Excellent slump resistance (stays in place)
  • Repairability
  • Flame retardancy: UL94V-0 equivalent
  • Glass bead option availability (180 & 250µ) for bond line thickness (BLT) control
  • Long-term reliability and exceptional performance
  • Consistent filling of multiple thickness gaps under one common heat sink
  • Excellent surface wetting
  • Excellent for maintaining contact through thermal cycling

Source: Techsil
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