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Patent

METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT


Application Date:
May 7, 2015
USPTO Patent:
US 14397968
Abstract:

Disclosed is a composition that can rapidly plasticise polymers, including, in relation to the total mass of (A) and (B): between 0.1 and 99 mass-% of at least one ester of 1,4:3,6-dianhydrohexitol (A), having a mol...

Inventors:
Thierry Feron, Fouquieres Les Bethune (FR)
Monique Sobocinski, La Couture (FR)
Herve Wyart, Cuinchy (FR)
Boris Breitscheidel, Waldsee (FR)
Jochen Wagner, Ruppertsweiler (DE)
International Classification:
C08K 5/1535 (20150507); C09D 7/12 (20150507); C09D 127/06 (20150507); C08K 5/12 (20150507); C08K 5/11 (20150507)
US Classification:
427/3855; 524/109; 106/2872; 264/311; 264/175

Claims

What is claimed is:

1-21. (canceled)

Description

FIELD OF THE INVENTION

The subject matter of the invention is a composition, of use as plasticizer for polymers, comprising at least one 1,4:3,6-dianhydrohexitol ester and a second compound having the role of plasticizer. Another aspect of the invention relates to the use of this 1,4:3,6-dianhydrohexitol ester as accelerator of the gelling of polymers.

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