The Universal Selection Source: Adhesives Ingredients

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Application Date:
Aug 10, 2017
USPTO Patent:
US 15499011
Abstract:

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence:

    • forming ...

Inventors:
Thomas Plach, Linz (AT)
Kurt Hingerl, Wolfern (AT)
Markus Wimplinger, Ried im Innkreis (AT)
Christoph Flotgen, Pramerdorf (AT)
International Classification:
H01L 23/00 (20170810)

Claims

What is claimed is:

1. A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate comprising the following steps: forming a first reservoir in a surface layer on the first contact surface and a second reservoir in a surface layer on the second...

Description

RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No. 14/007,999, filed Sep. 27, 2013, which is a U.S. National Stage Application of PCT/EP2011/055470 filed Apr. 8, 2011, said patent applications hereby fully incorporated herein by reference.

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