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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides

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Product Name
Supplier
Description
A&C Catalysts
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Transportation (excl. Automotive)>Aircraft & Aerospace
Technicure® Nano-Dicy is a pulverized grade of dicyandiamide with an average particle size of about 1-2 micron. Acts as a curing agent. Provides excellent adhesion to a variety of substrates and has... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Transportation (excl. Automotive)>Aircraft & Aerospace
  • Electrical & Electronic Bonding
A&C Catalysts
Dicyamdiamide. It acts as a curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
A&C Catalysts
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
DYHARD® 100S by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It possesses low shrinkage & toxicity and no... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
DYHARD® 100SF by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It offers extraordinary long latency and cost... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
DYHARD® 100SH by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It possesses low shrinkage & toxicity and no... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
DYHARD® D50EP by AlzChem is a latent hardener & masterbatch of curing agents or accelerators for thermosetting epoxy resin systems used in the adhesive industry. It is excellently pre-dispersed... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
DYHARD® DF50EP by AlzChem is a latent hardener & masterbatch of curing agents or accelerators for thermosetting epoxy resin systems used in the adhesive industry. It is excellently pre-dispersed... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Amicure® CG-1400 by Evonik is a dicyandiamide based micronized curing agent. It is a 0.5% of an inert flow control additive to inhibit clumping and improve handling. It can be used as a latent... view more
Applications
  • Polymers>Epoxies (EP)
Amicure® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. Amicure® CG-325 is used as a... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Poting & Encapsulating
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