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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Fillers / Extenders > Silicas

Silica is found in rich quantities on the earth’s crust in its crystalline (quartz) and amorphous (diatomaceous silica) forms. When used as an additive, diatomaceous silica increases the viscosity of an adhesive / sealant formulation. Diatomaceous silica provides less machining and abrasive problems and hence is used more extensively as a filler than quartz.
Product Name
Supplier
Description
Low α-silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Low α-silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Low α-silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is a unique nano silica powder. It gets dispersed in organic solvent easily. Possesses small particle size. It shows high dispersability, has high purity and high... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Silica. Acts as a filler. It is a unique nano silica powder. It gets dispersed in organic solvent easily. Possesses small particle size. It shows high dispersability, has high purity and high... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
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