Resorcinol-formaldehyde. It exhibits improvement in water resistance of adhesives curing at room temperature. Possesses compatibility with nylon, rayon and rubber... view more

Applications

Adhesives

AKROCHEM® P-07

Akrochem

Thermosetting, two-step phenolic resin. Used with nitrile rubber. Possesses a long flow, a medium to long cure and a soft set... view more

AKROCHEM® P-126

Akrochem

Heat reactive, alkyl phenolic resin. Used in neoprene AF based contact adhesives. Imparts low initial viscosity and very good viscosity-stability. Possesses good heat resistance... view more

Applications

Adhesives>Solvent based>Contact adhesives

AKROCHEM® P-147

Akrochem

Unmodified phenolic two-step resin... view more

AKROCHEM® P-179

Akrochem

One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal and vinyl plastics. Provides good... view more

Applications

Adhesives

AKROCHEM® P-40

Akrochem

Finely pulverized thermosetting phenolic resin of the two-step type. Used as a hardening and a reinforcing agent for nitrile, nitrile-SBR blends and polybutadiene polymers. Possesses medium flow... view more

AKROCHEM® P-79

Akrochem

One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal, and vinyl plastics. Provides good... view more

Applications

Adhesives

AKROCHEM® P-82

Akrochem

Finely pulverized thermosetting phenolic resin of the two-step type. Used as a hardening and a reinforcing agent for nitrile, nitrile-SBR blends, and polybutadiene polymers. Possesses medium flow... view more

AKROCHEM® P-87

Akrochem

Cashew nut oil modified phenol-formaldehyde two-step thermosetting resin. Used for modifying the properties of nitrile rubber compounds and solvent cements. Makes filler loading easier during... view more

Akroform® Resorcinol-80/EPR/P

Akrochem

Akroform® Resorcinol-80/EPR/P by Akrochem is a polymeric dispersion of resorcinol (1,3-Dihydroxybenzene) in EPR. Used with hexamethylenetetramine (HMT) or other methylene donors along with silica to... view more

Akrosperse® Resorcinol-40/NR/s

Akrochem

Akrosperse® Resorcinol-40/NR/s by Akrochem is a polymeric dispersions of Resorcinol (1,3-Dihydroxybenzene). Polymer bound or encapsulated dispersions eliminate any irritating dust, as well as other... view more

Saduren® 163

BASF

Saduren® 163 by BASF is a melamine-formaldehyde cross-linking agent. Used in nonwoven carriers based on PET- and glass fibers, filter nonwovens, nonwovens for hygiene and medical applications... view more

Applications

Adhesives
Medical
Non-woven

Urecoll® 150

BASF

Urecoll® 150 by BASF is urea-formaldehye resin. Used in nonwoven carriers based on PET- and glass fibers, filter nonwovens, nonwovens for hygiene and medical applications, interlinings and high loft... view more

Applications

Adhesives
Non-woven
Medical

Urecoll® A Liquid

BASF

Urecoll® A Liquid by BASF is urea-formaldehyde resin. Used in nonwoven carriers based on PET- and glass fibers, filter nonwovens, nonwovens for hygiene and medical applications, interlinings and... view more

Applications

Adhesives
Medical
Non-woven

Urecoll® HH

BASF

Urecoll® HH by BASF is odor free urea-formaldehyde resin with high initial tack. Used as an adhesive raw material suitable for converting paper and board. Urecoll® HH is also used in high-speed... view more

Applications

Adhesives
Labels / Signs / Decals>Bottles & Cans Labelling

View all 161 products in Aminoplastes / Phenoplastes (UF, MUF)

Recent Patents related to Aminoplastes / Phenoplastes (UF, MUF)

Dec 28, 2017 |USPTO
Amino Alkoxy-Modified Silsesquioxane Adhesives For Adhering Steel Alloy To Rubber - US 15540875

Dec 7, 2017 |USPTO
WAFER LAMINATE AND MAKING METHOD - US 15596146

Nov 23, 2017 |USPTO
SIZING COMPOSITION FOR MINERAL FIBERS AND RESULTING PRODUCTS - By Saint-Gobain - US 15670446

Aug 31, 2017 |USPTO
BONDED VENEER WITH SIMULATED WOOD GRAIN AND TEXTURE, BONDED VENEER PANELS AND METHOD OF MAKING THE SAME - US 15092668

Aug 30, 2017 |EPO
METHOD FOR MANUFACTURING A FLIP-CHIP TYPE SEMICONDUCTOR APPARATUS USING A PHOTOSENSITIVE ADHESIVE LAYER AND CORRESPONDING FLIP-CHIP TYPE SEMICONDUCTOR APPARATUS - EP 3211661 A2

Formulations containing Aminoplastes / Phenoplastes (UF, MUF)

2K Polyurea Sealant

Nylon –Thermosetting Resin Hybrid Adhesives (Melamine Formaldehyde)

Solvent Borne High Quality Polybutene / Butyl / Phenolic Caulking Compound

Polyvinyl Butyral-Phenolic Structural Adhesive (C)

Polyvinyl Butyral-Phenolic Structural Adhesive (B)

Help us improve the Universal Selector

You can’t find what you are looking for?
Please report missing products / suppliers, point out errors, or simply tell us how we could make the Universal Selector better.

Type*

Report a missing product / supplier
Report an error in a datasheet
Suggest an improvement

Professional Email*

Your feedback*

Submitting this form implies your acceptance to SpecialChem Terms & Conditions

Feedback

Report Missing Product/Supplier Report Error in Datasheet Suggest Improvement

Channel Alerts

Receive weekly digests on hot topics

Receive your alerts