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Adhesives Ingredients
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Adhesives Ingredients
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Resicure™ EMI-24

Technical Datasheet | Supplied by A&C Catalysts
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical resistance, high glass transition temperature and rapid reactivity at temperature less than 100°C with 9-12 hours latency. Resicure™ EMI-24 is used in electrical potting and encapsulation, one-component adhesives for electronics applications. Typical loading level as a sole curing agent in epoxy resin (EEW=190)is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr.
Product Type
  • Crosslinking / Curing / Vulcanizing Agents > Amines /Amides
  • Catalysts / Accelerators / Initiators > Amines & Amino Compounds
Chemical Composition
CAS Number

Compatiblity with other products

Find products that are predicted to be compatible with Resicure™ EMI-24.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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