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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Firstcure® DEAP

Technical Datasheet | Supplied by Albemarle
HSP Distance with Rewocoros® B 2045: 0.6
2,2-Diethoxyacetophenone. Used in adhesives. Offers non-yellowing properties, good shelf stability and a fast cure rate.
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Product Type
Photoinitiators
Chemical Composition
2,2-Diethoxyacetophenone
CAS Number
6175-45-7

Compatiblity with other products

Find products that are predicted to be compatible with Firstcure® DEAP.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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