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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Genamid® 2000

Technical Datasheet | Supplied by BASF
Genamid® 2000 by BASF is amidoamine resin of moderately low viscosity. Used as a curing agent for liquid or solid epoxy resins in adhesives. Genamid® 2000 offers high chemical and water resistance, hardness and flexibility.
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Amidoamines
Chemical Composition
Amidoamine
Physical Form
Liquid
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