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Adhesives Ingredients
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Adhesives Ingredients
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Genamid® 250

Technical Datasheet | Supplied by BASF
Genamid® 250 by BASF is a low viscosity amidoamine resin. Used as a curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is most commonly used with bisphenol A based epoxy resins that have an epoxide equivalent weight of approximately 190. It is suited for high solid formulations with low viscosity epoxy resins. Genamid® 250 gives rapid cure response.
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Amidoamines
Chemical Composition
Amidoamine
Physical Form
Various
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