Genamid® 250

Genamid® 250 by BASF is a low viscosity amidoamine resin. Used as a curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is most commonly used with bisphenol A based epoxy resins that have an epoxide equivalent weight of approximately 190. It is suited for high solid formulations with low viscosity epoxy resins. Genamid® 250 gives rapid cure response.