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Adhesives Ingredients

BYK® -R 605

Technical DataSheet | Supplied by Byk (Altana Group)

Solution of polyhydroxycarboxylic acid amides. Acts as a rheology modifier and filler. It increase hydrogen bonding when combined with hydrophilic fumed silica or organically modified clays resulting in good anti-sagging properties with improved flow and deaeration. Its low dosages stabilizes fumed silica in laminating resins and help prevent separation during resin storage. In polyols it is used to stabilize molecular sieves like zeolith. Used as thixotropy enhancing additives in unsaturated polyester, epoxy and vinyl ester. It can also be used in filled systems to prevent or reduce the sedimentation of fillers during storage. Its recommended levels are 20 - 50% fumed silica in vinyl ester resins, 10 - 30% fumed silica in other resins, 5 - 20% organically modified clay in unsaturated polyester and 0.5 - 2% inorganic fillers in base resin.

BYK® -R 605 Product details

Product Type
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  • xxxxxxxxxxxxxxxxxxxxxxxxx
Chemical Composition
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Product Status
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Applications/ Recommended for
  • xxxxxxxxx
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BYK® -R 605 Properties

Property

Value & Unit
Test Condition
Test Method
Density @ 20°C
xxxx g/ml
Flash point
xx °C
Non-volatile matter
xx %
Refractive index @ 20°C
xxxxx
Color number
xxxx gardner
Last edited Sep 13, 2017
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