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Adhesives Ingredients
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Adhesives Ingredients
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BYK® -A 530

Technical Datasheet | Supplied by BYK
BYK® -A 530 by BYK is a solution of foam-destroying polymers and polysiloxanes. Acts as a air release agent. It prevents foaming during manufacture and application of epoxy resin systems, so that blister- and pinhole-free systems with smooth surfaces are achieved. BYK® -A 530 is recommended for epoxy systems and also suitable for PUR systems. Its recommended level is 0.5 - 2 % additive based upon total formulation.
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Product Type
Release Agents
Chemical Composition
Solution of foam-destroying polymers and polysiloxanes
Product Status
COMMERCIAL
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