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Adhesives Ingredients
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Adhesives Ingredients
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ERISYS™ GE-23 LV

HSP Distance with AOI-VM™: 1.1
Diepoxidized polyglycol. Used as a reactive diluent of uncured high viscosity epoxy resins in adhesives. Reduces viscosity. Improves impact and thermal shock resistance, adhesion and flexibility. Decreases heat and chemical resistance.
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Product Type
Solvents > Ethers & Ethers Alcohols
Chemical Composition
Polyglycol Diglycidyl Ether
CAS Number
41638-13-5
SpecialChem additionnal informations based on CAS Number : 41638-13-5

Hansen Solubility Parameters

[17, 6.1, 7.6]
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[δD - Dispersion force interactions, δP - Polar force interactions, δH - Hydrogen bond force interactions]

Please note, these HSP values are estimations. It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters; δD (Dispersion force interactions), δP (Polar forces interactions) and δH (Hydrogen bond force interactions). Hansen Solubility Parameters can help you find a wide range of products that are predicted to be compatible with ERISYS™ GE-23 LV. A practical determination of these HSP values would provide higher certainty. Learn More.

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