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Adhesives Ingredients
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Adhesives Ingredients
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Amicure® CG-1200

Technical Datasheet | Supplied by Evonik
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in one-component adhesives Provides enhanced reactivity versus coarser grades. Easily dispersed in liquid resins. Shelf stability up to 6 months at 77 °F in properly formulated systems. Activation temperature can be easily varied from 355 °F to 203 °F with appropriate accelerator selection. Recommended Use Level (phr, EEW=190) 4-15
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides
Chemical Composition
Dicyandiamide
Physical Form
Powder
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