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Adhesives Ingredients
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Adhesives Ingredients
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Dicyanex® 325

Technical Datasheet | Supplied by Evonik
Dicyandiamide latent curing agent used for epoxy resins in one-component adhesives. Pulverized grade. Enhanced solubility in polar solvents (acetone, DMF). Provides clumping and dispersion into liquid resins, enhanced reactivity versus nonpulverized grades in solvent-free systems, shelf stability of up to 6 months at 25 °C in properly formulated systems.Activation temperature can be varied easily from 180 °C - 95 °C with appropriate accelerator selection. Typical cure schedule: 1-2 hr at 180 °C; 45 min at 120 °C with 0.5 parts of curing agent. Recommended Use Level (phr, EEW=190): 4-15.
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides
Physical Form
Powder
Product Status
COMMERCIAL
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