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The Universal Selection Source:
Adhesives Ingredients
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Versamid® 228

Modified polyamide/epoxy adduct. Used as curing agent and surfactant for liquid epoxy resins in waterborne and solvent-free sealants.
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Product Type
  • Crosslinking / Curing / Vulcanizing Agents > Amines /Amides
  • Surfactants > Amides
Chemical Composition
Modified polyamide/epoxy adduct
Physical Form
Liquid
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