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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Omicure® U-35M

Technical Datasheet | Supplied by Huntsman
HSP Distance with THIOCURE® GDMA: 0.6
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of curing. It provides long room temperature shelf life to epoxy/dicy formulations. Omicure® U-35M is suitable for encapsulation adhesives. Suggested use level is < 5 phr.
Product Type
Catalysts / Accelerators / Initiators
Chemical Composition
Cycloaliphatic bis urea
CAS Number

Compatiblity with other products

Find products that are predicted to be compatible with Omicure® U-35M.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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