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Adhesives Ingredients
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Adhesives Ingredients
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Naugard® HM-11

Technical Datasheet | Supplied by Addivant
Non-dusting, granular blend of hindered phenolic and diphenylamine antioxidants. Used in polyamide hot melt adhesives. Provides synergistic short and long-term thermal protection against oxidation in polypropylene. Offers very good color and viscosity stability, gelation and skinning resistance in SIS, SBS, EVA and PE. Possesses low volatility and compatibility with polymer and rosin ester.
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Product Type
  • Antioxidants > Phenolics
  • Antioxidants > Amines
Chemical Composition
Blend of hindered phenolic and diphenylamine
Physical Form
Granules
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