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Adhesives Ingredients
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TFM-C05P

Technical Datasheet | Supplied by Toyal
TFM-C05P by Toyal is a spherical, conductive filler. It contains copper as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity, oxidation-, moisture resistance and inking characteristics. It possesses plating of metals, ceramics and organic matter and plating film variations like Au, Ag, Cu and Sn. TFM-C05P is designed for conductive adhesives.
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Product Type
Fillers / Extenders
Product Status
COMMERCIAL
Applications/ Recommended for
Adhesives
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Last edited September 25, 2023
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