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Adhesives Ingredients
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Adhesives Ingredients
by SpecialChem
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Dynasylan® SILBOND® EG

Technical Datasheet | Supplied by Evonik
HSP Distance with AL 171: 0.3
Dynasylan® SILBOND® EG by Evonik is tetraethyl orthosilicate. It has 99.8% of the active content and contains low water content. It is an excellent source of high purity silica. It gets hydrolyzed in water. Dynasylan® SILBOND® EG is an excellent source of high-purity silica for sol-gel processes
Product Type
Silicon-based Monomers
Chemical Composition
Tetraethyl Orthosilicate
CAS Number

Compatiblity with other products

Find products that are predicted to be compatible with Dynasylan® SILBOND® EG.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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