The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Technical Datasheet | Supplied by INVISTA
HSP Distance with Neol® Neopentylglycol: 1.1
High-purity adipic acid. Possesses very good uniformity. Used as a raw material of urethane and copolyamide adhesives. Exhibits typical carboxylic acid chemistry. Undergoes amidation, reduction, halogenation, dehydration, neutralization to form salts and esterification. Shows good tensile properties, low temperature flexibility, very good abrasion and organic solvent resistance in adipate-based polyurethanes. Offers flexibility and improved water resistance when fatty polyamides are used for epoxy curing.
Product Type
Chemical Composition
Hexanedioic acid
CAS Number

Compatiblity with other products

Find products that are predicted to be compatible with Adi-pure®.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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