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Adhesives Ingredients
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Adhesives Ingredients
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Celloxide 2021

Technical Datasheet | Supplied by Daicel
Alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no halogen impurities such as chlorine, superior transparency and high heat-deformation temperature.
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Product Type
Epoxies (EP)
Chemical Composition
(3'-4'-Epoxycyclohexane)methyl 3'-4'-epoxycyclohexyl-carboxylate
CAS Number
2386-87-0

Compatiblity with other products

Find products that are predicted to be compatible with Celloxide 2021.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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